Local time October 8, 2026, leading wafer foundry GlobalFoundries announced a manufacturing agreement with TSMC to establish silicon interposer supply in the United States for TSMC’s CoWoS® advanced packaging ecosystem.
Under the agreement, GlobalFoundries will provide manufacturing services to TSMC and add production capacity at its Malta, New York fab to meet the rising demand for high-performance computing and AI systems. The agreement lays the groundwork for capacity scaling in tandem with growing customer demand.
GlobalFoundries plans to expand capacity at its Malta fab and build the U.S.’s first domestic source of silicon interposers to support advanced packaging technologies including embedded deep trench capacitor components. The additional manufacturing capacity will deliver greater scale and flexibility for providing advanced packaging solutions across multiple generations of products.
“Advanced packaging is becoming increasingly critical to delivering the performance, energy efficiency and scale required for next-generation AI systems,” said Ed Kaste, Senior Vice President of GlobalFoundries’ CMOS Business. “By leveraging GlobalFoundries’ trusted U.S. manufacturing footprint to deliver manufacturing services, we are creating a secure, scalable supply source for key advanced packaging components, which will help customers accelerate innovation and strengthen the semiconductor supply chain.”
Volume production is expected to ramp up at GlobalFoundries’ Malta fab in the first half of 2028. The agreement has an initial five-year term and establishes a framework for future capacity expansion.
(Reprinted from https://news.eccn.com/）