According to The Chosun Ilbo, as high-bandwidth memory (HBM) transitions from the 5th-generation HBM3E to the 6th-generation HBM4, Samsung Electronics plans to raise its supply prices for 2027 to more than double the current level, representing a price hike of over 100%.
The report highlights three major driving factors behind Samsung Electronics’ planned steep increase in 2027 HBM pricing.
First, strong pricing for general DRAM. Market research firm TrendForce forecasts that contract prices for standard DRAM will rise 10% to 15% quarter-on-quarter in Q4 2026, while DRAM contract prices including HBM will increase 15% to 20% quarter-on-quarter. Goldman Sachs, a foreign investment bank, analyses that rising revenue from standard DRAM production necessitates a corresponding price increase for HBM.
Second, rising wafer consumption and advanced process costs. HBM chiplets are relatively large, and generational upgrades push up wafer consumption. In addition, Samsung’s HBM4 base die adopts the 4nm logic process, resulting in a notable cost increase. Goldman Sachs states that most newly added DRAM capacity will be consumed by HBM, constraining the supply of standard DRAM and sustaining high prices, creating a cycle that underpins HBM price growth.
Third, price hike spillover effect from Micron. Micron has recently signed contracts for most of its 2027 HBM capacity at prices higher than those for 2026. Micron’s confirmed substantial price increase further creates room for Samsung Electronics and SK Hynix to follow suit and adjust prices to reflect market conditions.
KB Securities also predicts that Samsung Electronics’ HBM selling prices will climb more than 100% in 2027. Market research institute TrendForce estimates the global average HBM price increase will hit 121% in 2027.
Samsung Electronics kicked off mass production of HBM4 in February 2026, with shipments expected to grow substantially in 2027. The company has secured a considerable volume of 2027 orders from key customers including NVIDIA and Broadcom, and price negotiations have entered the final stage this month.
Semiconductor industry insiders note that tight supply across both standard DRAM and HBM markets will most likely put Samsung Electronics in a dominant position during negotiations. Nevertheless, the ultimate improvement in profit margins will hinge on HBM4 yield rates, the pace of customer certification and wafer allocation strategies, which warrant continued monitoring.
Hana Securities projects that with expanding HBM4 shipments, HBM will account for approximately 15% of Samsung Electronics’ total DRAM revenue in 2027. Should the 100% price increase materialise, the proportion may further expand to between 20% and 30%.
(Reprinted from https://news.eccn.com/）