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Winbond Electronics’ August Revenue Surges 289.43%

2026-09-07

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    On September 4, major memory chip manufacturer Winbond Electronics reported its consolidated August 2026 revenue, including subsidiaries such as Nuvoton Technology. Revenue hit NT$27.309 billion, representing a year‑on‑year jump of 289.43% and a modest sequential growth of 2%. Its cumulative revenue for January‑August 2026 reached NT$152.178 billion, soaring 177.39% compared with the same period last year.

    Despite the robust financial performance, Chen Pei‑ming, General Manager of Winbond Electronics, has issued a supply‑shortage warning for the next two years. He pointed out that existing facilities and production capacity are running at full utilization, leaving Winbond facing a capacity vacuum with no spare output over the coming two years. He went further to state that supply shortages in 2027 will be more severe than those in 2026. To secure future supply, many key customers are pressing Winbond and are willing to pay premium rates to lock in long‑term supply agreements (LTAs) for 2029 and even 2030, on top of existing 2028 contracts.

    To ease tight capacity, Winbond Electronics is carrying out comprehensive upgrades at its existing Kaohsiung fab, targeting year‑end capacity of 24,000 wafers per month with the full roll‑out of the more efficient 16 nm advanced process technology. Most notably, Winbond’s board of directors has approved a large‑scale new‑plant expansion project in Kaohsiung. Construction of the new facility is scheduled to kick off in January 2027. Its clean‑room area will double that of the current Kaohsiung plant. The site will adopt 14 nm and 12 nm process technologies, with mass production expected by the end of 2029 to meet explosive market demand in 2030.

    In addition, Winbond has unveiled its micro‑silicon capacitor technology. State‑of‑the‑art next‑generation AI chips from NVIDIA and other players impose stringent requirements for current stability, while conventional components cannot satisfy their ultra‑thin and miniaturized dimensional constraints. Winbond’s in‑house‑developed micro‑silicon capacitors are well‑positioned to fill this market gap. Chen Pei‑ming is optimistic about its unique value, setting a target for silicon‑capacitor‑related businesses to account for 5%‑10% of total company revenue by 2027, building a core technical moat for the enterprise.



(Reprinted from https://news.eccn.com/)

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