Amkor Technology, the world’s second-largest OSAT (Outsourced Semiconductor Assembly and Test) provider, announced a strategic partnership with Intel at this year’s Intel Foundry Direct Connect event. Under the partnership, Amkor will adopt the EMIB (Embedded Multi-die Interconnect Bridge) packaging process across its global manufacturing facilities to establish alternative supply sources for EMIB.
According to the latest report from South Korean media ETNews, Amkor has decided to build EMIB production capacity at its K5 factory located in Songdo, Incheon, South Korea. This decision is based on the factory’s existing equipment being fully capable of meeting the requirements of the advanced EMIB packaging process, coupled with abundant local resources including materials, components, and talent.
Sources indicated that Amkor’s Incheon Songdo K5 factory will not only handle EMIB packaging for chips from Intel’s Product Groups but also provide services to external customers of Intel Foundry Services.
In addition to South Korea, Amkor will also introduce Intel’s EMIB process at its manufacturing facilities in Portugal and Arizona, USA.
(Reprinted from https://news.eccn.com/）