Driven by the surge in end-user demand, integration of edge computing technology, and increased investment, robots have accelerated their application in industrial, service, entertainment, and other fields in recent years. According to IDC forecasts, the global robot market size is expected to exceed USD 400 billion by 2029.
As an integration of multiple cutting-edge technologies, the operation of robots relies on the collaborative work of various chips and semiconductor devices, including main control chips (the "brain"), motion control chips (the "cerebellum"), sensor chips, power semiconductors, and power management chips. Semiconductor packaging and testing technology ensures that these chips operate with high energy efficiency. As a leading enterprise in the packaging and testing industry, Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) has continuously expanded its business layout in the fields of embodied intelligent humanoid robots and industrial robots in recent years. It enables high-density, high-performance, and high-reliability chip integration for robots in limited spaces, enhancing their capabilities in intelligent decision-making, precise movement, environmental perception, and energy utilization.
JCET has established a comprehensive packaging and testing solution and global delivery capability for the robot field. In the field of industrial robot control chips, relying on advanced packaging technologies such as heterogeneous integration and System-in-Package (SiP), it has achieved innovative breakthroughs in MCU, FPGA, and xPU packaging—moving from 2D to 3D packaging—meeting the core functional requirements of robots such as motion control and path planning.
For sensor and power device packaging, JCET provides industry-leading packaging and testing services for devices such as Micro-Electro-Mechanical Systems (MEMS), power devices, and Intelligent Power Devices (IPD). These services are widely applied in robot perception systems and drive modules, enabling high-reliability packaging of sensor chips. In scenarios such as smart homes and service robots, JCET offers a variety of miniaturized and highly integrated packaging solutions to support AI functions such as voice recognition and image processing.
Currently, JCET has carried out in-depth cooperation with a number of well-known global customers in the robot field, jointly developing solutions such as System-in-Package (SiP) for control systems, which improves system integration and reliability.
Looking ahead, as the application of robots expands rapidly across various fields, JCET will continue to leverage its leading advantages in the packaging and testing field, continuously optimizing advanced technologies such as high-density SiP and heterogeneous integration, to better meet the development needs of the future robot industry.
(Reprinted from https://news.eccn.com/）