Biwin Storage announced in a public notice that the Company and its holding subsidiary Guangdong Xincheng Hanchi intend to sign a cooperation agreement with the Administrative Committee of Songshan Lake High-tech Industrial Development Zone in Dongguan to invest in and construct Phase III of the wafer-level advanced packaging and testing manufacturing project, with a total investment of approximately RMB 4.5 billion, including RMB 4 billion in fixed asset investment.
The project will not involve additional land acquisition, and all construction activities will be carried out on the existing industrial land of the original project. The Company stated that this investment represents capital increase and production expansion based on the existing project. The funding will come from internal resources and self-raised capital, with no proceeds from fundraising involved.
The investment proposal was approved by the Board of Directors on September 21 and does not require submission to the Company’s shareholders’ meeting for review. Biwin Storage noted that it will push forward the signing of the project cooperation agreement as soon as possible to facilitate project implementation.
The planned investment of RMB 3.09 billion for Phase I and Phase II of Biwin Storage’s wafer-level advanced packaging and testing manufacturing project has been completed, with equipment deliveries underway, supporting a monthly 2.5D capacity of approximately 3,000 wafers.
To date, Phase I has finished plant construction as well as equipment installation and commissioning. Equipment for Phase II is being delivered and installed sequentially, and the project is currently in the stages of customer sampling, process verification and low-volume trial production, with no mass production revenue generated yet.
During institutional research in Q1 this year, Biwin Storage stated that its wafer-level advanced packaging and testing project is projected to reach a monthly capacity of 5,000 wafers by the end of 2026 and 10,000 wafers by the end of 2027, and is expected to start generating revenue at the end of 2026.
As the implementing entity of the wafer-level advanced packaging and testing manufacturing project, Guangdong Xincheng Hanchi has established capabilities covering multiple advanced packaging technologies including 2.5D, RDL, Fan-in and Fan-out.
Biwin Storage’s advanced packaging technology roadmap focuses on two major product lines: the FOMS series for advanced memory chips and the CMC series for advanced memory-computing co-packaging. According to Biwin Storage, the yield rate of its advanced packaging process has exceeded 95%, and the comprehensive gross profit margin of the advanced packaging business is projected to stand at 30% to 40%.
Besides its advanced packaging layout, in the controller chip segment, Biwin Storage’s self-developed domestic eMMC controller chips have achieved mass production and delivery across multiple sectors this year. UFS controller chips have passed silicon return verification and are scheduled for end-market adoption in H2 2026.
Meanwhile, Biwin Storage is making inroads into small-capacity NAND Flash media design. It has entered into a strategic cooperation agreement with a leading domestic foundry to develop mid-and-small-capacity SLC/MLC NAND products at process nodes such as 24nm and 19nm. Its SLC NAND products are undergoing silicon return verification with performance metrics meeting expectations, and are planned to be rolled out to end customers in H2 2026. R&D of MLC NAND Flash is progressing steadily.
In the enterprise (server) segment, Biwin Storage continues to ramp up R&D investment and market expansion of enterprise-grade storage products targeting high-throughput and high-reliability scenarios including data centers, cloud computing and AI servers. The Company is deepening cooperation with top-tier OEM vendors such as Lenovo to finalize long-term cooperation frameworks, and advancing business cooperation with internet cloud vendors. At the same time, Biwin Storage has realized volume shipment of products including PCIe SSDs and SATA SSDs.
(Reprinted from https://news.eccn.com/）