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Jingener Completes C-round Financing of RMB 630 Million, Ushering in a New Paradigm for AI Power Electronics

2026-09-21

    Recently, Zhejiang Jingener Microelectronics Co., Ltd. has secured RMB 630 million in its Series C financing. This marks the company’s fifth financing round since its establishment four years ago, bringing its total financing amount to nearly RMB 2 billion. The financing fully demonstrates the capital market’s strong recognition of the company’s technical roadmap, development pace and commercialization capabilities.

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    With the rapid expansion of the AI industry, power electronics has emerged as a fundamental and critical track for next-generation high-end industries. Building on its technological expertise accumulated from automotive-grade SiC modules, Jingener Microelectronics is advancing into higher-end sectors including data centers, aerospace, and controlled nuclear fusion, striving to develop key technologies for new-generation electric power control.

    The company’s product portfolio covers automotive-grade power modules, AI-grade SST modules, embedded SSCB modules, multi-die tantalum capacitors and more. Centered on the core technical pillars of ultra-high reliability and ultimate conversion efficiency, these products closely align with evolving application scenarios, accurately address key application pain points, and drive innovation in AI power supply architecture systems.

    Proceeds from this round of financing will be primarily allocated to R&D iteration of core products, production line construction and upgrades to reliability verification platforms. The company will also scale up market development, advance the implementation of benchmark projects across various sectors, and improve collaborative layout of upstream and downstream industrial chains.

    Pan Yunbin, CEO of Jingener Microelectronics, stated that the development of the AI industry relies on solid support from underlying power electronics technologies. The company will reuse technical capabilities refined from automotive-grade products across different fields, continue collaborative innovation with leading industry clients, and deliver more competitive technical solutions driven by diverse high-end scenarios to facilitate high-quality development of cutting-edge hard-tech industries.



(Reprinted from https://news.eccn.com/)

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