September 17, 2026 — NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the official launch of a joint technology innovation lab with Shenzhen Hangsheng Electronics Co., Ltd. (hereinafter referred to as Hangsheng). Against the backdrop of the accelerated evolution of "AI-defined vehicles", the lab will focus on key areas including smart cockpits, software-defined vehicles and innovative AI applications, speeding up the transition of smart vehicle innovations from proof-of-concept to large-scale deployment.
NXP and Hangsheng have maintained a partnership spanning more than three decades. Back in April this year, the two parties signed MoU 2.0 and reached a strategic consensus on system-level collaboration. The establishment of this joint technology innovation lab marks the transition of their cooperation from strategic planning to project implementation.
Leveraging the joint technology innovation lab, both sides will carry out collaborative innovation across multiple priority areas. In the smart cockpit segment, the two parties will deploy system-level solutions for multiple customer projects based on NXP’s i.MX 9 platform and NXP’s extensive portfolio of wireless connectivity products. In the field of software-defined vehicles, they will conduct joint R&D, pre-research verification and POC design for software-defined platforms built on NXP CoreRide platform and S32K5 automotive microcontrollers to facilitate the rollout of next-generation electrical and electronic architectures. Meanwhile, the two sides will prioritize the development and commercial adoption of innovative platforms such as AI edge computing, exploring more possibilities for deep AI integration in automotive scenarios. Moving forward, they will continue to explore and cooperate in end-side AI, embodied intelligence and software ecosystem integration.
Yang Hong, Chairman and President of Hangsheng Group, stated: “The launch of the joint technology innovation lab represents another milestone in the deepening collaboration between Hangsheng and NXP. It is also a critical step for Hangsheng to empower the development of smart vehicles through technological innovation and accelerate its transformation into an AI-driven technology enterprise. Both parties will combine our respective strengths in chip platforms, system R&D and industrialization, accelerate the conversion of innovative technologies into mass-production projects, continuously boost product competitiveness and innovation efficiency, and deliver globally competitive system-level solutions for OEM customers.”
Li Xiaohe, Executive Vice President and General Manager of NXP Semiconductors China, commented: “China’s automotive industry is now at a pivotal stage of accelerated intelligentization and AI development. The inauguration of the joint technology innovation lab is a major milestone in translating the deepened strategic partnership between NXP and Hangsheng into tangible results. Drawing on extensive experience accumulated in real-world edge applications, NXP fully understands the importance of performance, functional safety, cybersecurity and energy efficiency for system design. We embed these core capabilities into our product portfolios, AI and software enablement packages, and system-level solutions tailored for diverse application scenarios. Through close joint collaboration, trusted application deployment, systematic expertise and scalable solutions, we help customers reduce development complexity, shorten time-to-market, and optimize system-level performance and total cost of ownership.”
(Reprinted from https://news.eccn.com/）