On August 27, Yanwei (Jiangsu) Semiconductor Technology Co., Ltd. (hereinafter referred to as Yanwei Semiconductor) announced the completion of its Series‑B financing, raising a total of nearly RMB 1.5 billion.
Industrial investors including CETC Industrial Fund, CRRC Capital and BOE made strategic investments in this financing round. Other participating institutions include CICC Capital, V‑Star Capital, Huatai Zijing, Bohua Industrial Investment, CMB AIC, BOC AIC, Houji Capital, Hard‑Core Nut Capital, Gaoxin Capital, Shanzheng Innovation Investment and Sorghum Capital. Meanwhile, existing shareholders such as Xidong Hi‑Tech Investment, Hushan Capital, Xinke Capital, Dianshi Capital, TEDA Venture Capital, Linxin Investment, Xinshang Capital and Xianghe Capital increased their investments.
Yanwei Semiconductor stated that the newly‑raised funds will be mainly allocated to core‑product iteration, production‑capacity expansion and R&D scale‑up. The financing will further consolidate the company’s technological advantages in high‑end semiconductor thin‑film deposition equipment and accelerate the localization substitution of such equipment.
According to official website information, Yanwei Semiconductor was founded in 2022 and is located in Wuxi High‑Tech Zone. The company is dedicated to the R&D, manufacturing and sales of internationally‑competitive semiconductor equipment with independent intellectual property rights. Its core focus covers equipment and process technologies including Atomic Layer Deposition (ALD), Silicon Epitaxy (Si EPI), Plasma‑Enhanced Chemical Vapor Deposition (PECVD), Silicon Carbide Epitaxy (SiC EPI) and Atomic Layer Etching (ALE).
(Reprinted from https://news.eccn.com/）