The semiconductor sector on the A‑share market rallied broadly in early trading today. CXMT Technology, a leading domestic memory manufacturer, saw its share price climb steadily, with an intraday gain of up to 9.6%. Its total market value re‑crossed the RMB 4‑trillion threshold, securing its position as the most valuable company on the A‑share market.
The chip sector witnessed robust trading activity on the day, with Hong Kong‑listed chip stocks also moving higher. The memory sub‑sector posted notable gains. Puyan Co., Ltd. came close to hitting the daily trading limit, while memory‑related firms including Demingli, Biwin Storage and Hengshuo Co., Ltd. rose in tandem as capital flowed heavily into this track.
The market upturn is backed by solid industry fundamentals. Senior executives from multiple overseas major memory manufacturers have publicly stated that a supply gap for memory products will emerge and the tight supply situation will last at least until 2027.
AI servers and smart devices have generated massive demand for memory. Global memory chip supply fails to keep pace with demand growth, and domestic memory module enterprises are set to deliver sustained profit improvements going forward.
Brokerage analysts note that the ongoing explosive demand for computing‑power equipment is directly driving demand for advanced chips and memory production capacity.
Domestic memory players have clear capacity‑expansion roadmaps, and domestic substitution is accelerating. Supporting chip equipment and electronic materials are also overcoming capacity bottlenecks, ushering in a performance‑growth cycle across the entire industrial chain.
Headquartered in Hefei, Anhui Province, CXMT Technology was founded in 2016 and was listed on the STAR Market on July 27, 2026. It is the only enterprise in Chinese mainland that has achieved full‑process independent mass production of DRAM memory chips. Adopting the IDM model, it handles chip design and wafer manufacturing entirely in‑house.
Worldwide, only four vendors are capable of end‑to‑end self‑developed and self‑produced DRAM: Samsung, SK Hynix, Micron and CXMT Technology.
(Reprinted from https://news.eccn.com/）