According to The Indian Express, a company backed by Intel Capital is launching India’s first advanced 3D chip packaging plant. The project is developed by U.S.-based 3D Glass Solutions (3DGS), with Intel investing through its wholly owned Indian subsidiary Heterogeneous Integration Packaging Solutions.
3DGS is regarded as a global pioneer in glass substrate packaging. As reported by ANI, investors in 3DGS include Intel as well as U.S. defense and aerospace company Lockheed Martin. Notably, Reuters reported that since Lip-Bu Tan became CEO of Intel, Intel Capital has invested a total of $8 million in 3DGS across two funding rounds. Walden International, founded by Lip-Bu Tan, holds a 9.6% stake following the second financing round.
Additionally, Prameya News reported that Intel CEO Lip-Bu Tan attended the event virtually, praising the leadership of Prime Minister Modi. He also highlighted the strengths of Odisha, India, noting that reliable infrastructure including power and water supplies, along with a skilled workforce, serve as key drivers for advanced manufacturing.
Records show the facility involves an investment of 19.34 billion Indian rupees (approximately $200 million) and was approved last year under India’s Semiconductor Mission (ISM) scheme. Upon full completion and ramp-up, the plant will be able to produce roughly 69,600 glass substrates, 50 million assembly units, and 13,200 3DHI modules annually. These products are expected to serve applications in defense, high-performance computing, artificial intelligence, radio frequency, automotive sectors, as well as photonics and integrated optics.
Meanwhile, ETtech pointed out that the facility is designed as a vertically integrated operation, combining substrate manufacturing, assembly, and advanced packaging in a single location — distinguishing it from the traditional OSAT model. It aims to deploy technologies such as glass interposers and 3D heterogeneous integration modules.
The project is one of two semiconductor-related investments previously approved by the Odisha government in 2025. The other, led by SiCSem Private Limited, will manufacture silicon carbide devices for use in defense, electric mobility, railway infrastructure, and renewable energy systems.
India’s Minister of Information Technology has hinted at potential increased investment from global corporations. According to ETtech, three more electronics and semiconductor-related proposals are currently in the pipeline. The minister added that discussions are ongoing with large global companies including Intel regarding future investments in the state.
Regarding Intel’s broader advanced packaging business, The Edge Malaysia reported that the chipmaker’s advanced packaging complex and assembly operations in Malaysia are scheduled to become operational later this year.
(Reprinted from https://news.eccn.com/）