On August 12, leading wafer foundry TSMC stated that, after a comprehensive evaluation, it has decided to gradually exit 6-inch wafer manufacturing within two years and continue to consolidate 8-inch wafer production capacity, aiming to optimize organizational operations, enhance operational performance, and improve operational efficiency.
TSMC pointed out that this decision is based on market conditions and long-term business strategies. The company is working closely with customers to ensure a smooth transition during the period and is committed to continuing to meet customer needs. TSMC will remain focused on creating sustained value for its partners and the market.
TSMC emphasized that the decision to gradually exit the 6-inch wafer manufacturing business will not affect its previous financial targets. TSMC had previously estimated that its dollar-denominated revenue would grow by approximately 30% this year.
Currently, TSMC operates four 12-inch mega fabs, four 8-inch fabs, and one 6-inch fab in Taiwan, China. In 2024, TSMC and its subsidiaries had an annual production capacity of nearly 17 million 12-inch equivalent wafers.
(Reprinted from China Grid https://news.eccn.com)