On June 18 local time in 2026, Intel announced the appointment of Seok-Hee Lee as Executive Vice President of Intel Foundry. Reporting directly to Intel CEO Lip-Bu Tan, he will oversee advanced packaging, system integration, back-end technology development and back-end manufacturing, strengthening the company’s system-level integration capabilities for the era of artificial intelligence and high-performance computing.
As part of the ongoing evolution of Intel’s foundry strategy, Intel is establishing advanced packaging as a dedicated business segment supported by a specialized leadership team. This move reflects the rising importance and growing complexity of packaging technologies, which are critical to boosting performance, energy efficiency and heterogeneous integration for AI systems.
Intel CEO Lip-Bu Tan commented: “Advanced packaging and system integration have become core competencies for next-generation computing architectures. Seok-Hee brings deep expertise in leading large-scale, sophisticated technology and manufacturing organizations paired with exceptional operational execution capabilities. His strategic vision will further elevate Intel’s system integration strengths, enabling tight integration of cutting-edge logic, memory, networking and other components to build high-performance computing systems for Intel Foundry customers. As we prepare for broad commercial deployment of advanced packaging technologies including EMIB-T and HBI for clients and partners, Seok-Hee is the ideal leader to build and scale this vital pillar of Intel Foundry.”
Prior to joining Intel, Seok-Hee Lee served as President and CEO of SK On from 2023 to 2026. Before that, he held the role of President and CEO at SK Hynix between 2018 and 2022. A seasoned semiconductor veteran, he previously held engineering leadership roles at Intel and in academia from approximately 1990 to 2010, cultivating profound know-how in advanced process technologies and high-volume manufacturing.
Seok-Hee Lee stated: “Demand for system-level integration is surging rapidly across artificial intelligence and high-performance computing. Intel holds unique strengths in advanced packaging and is well-positioned to steer industry advancement. I am delighted to return and join the Intel team to collectively sharpen the company’s technological leadership, manufacturing scale and customer commitments within this critical domain.”
Following this organizational adjustment, Naga Chandrasekaran, Executive Vice President of Intel Foundry, will continue reporting to CEO Lip-Bu Tan and take charge of front-end technology development and front-end manufacturing, accelerating mass production rollout for Intel 18A, Intel 14A and subsequent process nodes. He will also retain oversight of design enablement and end-to-end enablement functions for customers and business units to fuel Intel Foundry’s growth momentum. This newly refined, targeted and scalable operating model reinforces Intel’s commitment to advancing its technology development and manufacturing prowess, fostering greater confidence among customers and partners in Intel’s fast, consistent and predictable product delivery.
As part of the same announcement, Intel also revealed that Executive Vice President Navid Shahriari will retire after an illustrious 37-year career with the company.
(Reprinted from https://news.eccn.com/）