Amid continuous rising power consumption of AI chips, silicon interposers adopted by mainstream packaging solutions such as CoWoS have hit thermal dissipation limits, making material innovation the key to breaking bottlenecks in advanced packaging. According to Fortune Business Insights, the global advanced packaging market reached $42.3 billion in 2025 and is projected to grow to $70.4 billion by 2034. Driven by the high-computing era, the advanced packaging industry embraces broad development prospects.
As a leading domestic player with full-industry-chain layout in compound semiconductors, Sanan Optoelectronics has strategically entered wide-bandgap material tracks including silicon carbide and diamond. Focusing on three core segments — AR optics, interposers and heat sinks — the company has built distinctive competitive advantages in advanced packaging. Multiple technological achievements have entered sample delivery or mass production stages, providing critical references for performance enhancement of global AI chips.
AR Optical Substrates: Empowered by Wide-Bandgap Materials to Consolidate Optical Packaging Foundation
For AR optical substrates, silicon carbide features a refractive index of 2.7, compared with approximately 2.0 for traditional glass, and its thermal conductivity is over 100 times higher than glass, delivering outstanding optical and thermal performance. Sanan Optoelectronics integrates comprehensive service capabilities for Micro LED and silicon carbide optical materials. Currently, its 8-inch optical silicon carbide substrates have passed customer qualification, while 12-inch products have achieved small-batch delivery, offering core material support for performance upgrading of AR devices.
Silicon Carbide Interposers: Solving Thermal Pain Points to Meet High-End AI Packaging Demand
Silicon carbide interposers effectively address critical heat dissipation challenges. With thermal conductivity around three times that of silicon, they can lower GPU junction temperature by 20–30°C and reduce heat dissipation costs by roughly 30%. At present, Sanan Optoelectronics’ 12-inch silicon carbide substrates are undergoing packaging verification for next-generation AI chips with leading customers, poised to become a mainstream option for advanced packaging solutions.
Heat Sink Business: Dual-Material Layout to Meet Diversified Thermal Management Needs
In the heat sink sector, Sanan Optoelectronics adopts a dual-track strategy covering diamond and silicon carbide to satisfy diverse heat dissipation requirements. Diamond heat sink substrates deliver a thermal conductivity of 2300W/(m•K), greatly lowering thermal resistance compared with ceramic substrates in high-power laser applications. The products have passed 1,000-hour aging tests and entered mass delivery. Silicon carbide heat sink products have completed sample testing and are steadily advancing toward commercialization.
Full-Chain Capacity Layout: Securing Supply to Support Large-Scale Technology Implementation
Capacity deployment underpins industrial technology commercialization. Sanan Optoelectronics has established two core manufacturing bases in Hunan and Chongqing, achieving full-chain independent manufacturing capabilities ranging from substrates to modules.
At the Hunan base, the monthly capacity of 6-inch silicon carbide chips reaches 16,000 wafers; 8-inch substrates register a monthly capacity of 1,000 wafers with epitaxy capacity hitting 2,000 wafers per month, and the 8-inch chip production line has commenced mass production. The Chongqing base boasts a monthly capacity of 3,000 8-inch substrates, with capacity gradually ramping up to strengthen the supply of large-size silicon carbide materials.
Hunan Sanan’s silicon carbide diodes cover a full voltage range from 650V to 2000V, with cumulative shipments exceeding 400 million units and total sales revenue of nearly RMB 2 billion within three years of operation. It holds leading industrial strength in China’s silicon carbide power device market, laying a solid market foundation for the industrialization of advanced packaging materials.
Centered on wide-bandgap technologies, Sanan Optoelectronics consolidates the industrial foundation of advanced packaging materials. With forward-looking layout of cutting-edge processes, the company will continue to lead breakthroughs in core materials, empower the performance upgrading of global AI chips with Chinese solutions, and drive the advanced packaging industry toward high-end development.
(Reprinted from https://news.eccn.com/）