According to the official WeChat public account of Giga Semiconductor, during the "Co-create Value, Grow Together" 2026 Semiconductor Technology Innovation Seminar held in Shanghai on April 2, Giga Semiconductor formally signed a project cooperation agreement with Infineon.
The 2026 Semiconductor Technology Innovation Seminar brought together more than 260 industrial chain partners from automotive, embodied intelligence, chip design and other fields for in-depth exchanges on technological innovation and ecological collaboration.
As a highlight of the seminar, Giga Semiconductor and Infineon signed a project cooperation agreement. The two parties will deepen technical cooperation in fields including embedded non-volatile memory, and jointly upgrade specialty process foundry capabilities.
In addition, guest speakers from United Automotive Electronic Systems, Fourier Intelligence Group, Fudan University and other institutions delivered insightful presentations on cutting-edge topics such as new-generation electronic and electrical architecture, embodied intelligence, and novel memory devices. All participants agreed that competition in the foundry industry has shifted from capacity and price to solution-oriented service capabilities, and industrial collaboration will become the core driver of future development.
Giga Semiconductor has established two major manufacturing bases in Lingang and Xuhui, and has passed the German Automotive Industry Quality Standard Grade A audit, making it a specialty process foundry with complete automotive-grade chip manufacturing qualifications. Adhering to the core values of "Integrity, Innovation, Cooperation, Win-Win", the company takes integrity as its foundation and is responsible for every wafer; regards innovation as the source of development and achieved key breakthroughs in automotive-grade SiC MOSFET, high-voltage IGBT, advanced BCD and 40/28nm logic processes; emphasizes cooperation to gather industrial strength and opens up to partners across the chain; and pursues win-win results to help partners create value through collaborative development.
At the seminar, Giga Semiconductor showcased its latest achievements in mixed-signal platforms and comprehensive foundry capabilities, systematically outlined the development layout of CMOS and BCD process platforms, and clearly put forward a technical roadmap for building solution-oriented foundry capabilities.
In terms of memory technology layout, Giga Semiconductor has developed three parallel routes: eFlash, SONOS and RRAM, providing diversified options for customers. The newly introduced SONOS technology features excellent process compatibility, low integration cost and sufficient mass production data, further enriching Giga’s solutions for high-reliability and cost-sensitive applications. Relying on its continuously improved process system, Giga provides customers with one-stop foundry services covering "memory + control + driver + power", realizing an upgrade from single-process advantages to solution-based platform capabilities.
(Reprinted from https://news.eccn.com/）