To Address High 2nm Costs, Apple A20 Series Will Adopt WMCM Packaging

  According to foreign media outlet wccftech, the A20 series processors powering Apple's iPhone 18 series, set to launch in 2026, will mark the first adoption of TSMC's 2nm process. They will also transition from the current InFO packaging to the Wafer-Level Multi-Chip Module (WMCM) solution. This move aims to enhance yield rates, reduce material consumption, and alleviate cost pressures brought by advanced manufacturing processes through packaging innovation.

  Compared to the current InFO (Integrated Fan-Out) packaging, which uses a PoP (Package on Package) vertical stacking approach—placing memory directly atop the processor, employing a Chip First process to form RDL (Redistribution Layers) on the chip, and then encapsulating memory in the upper layer—WMCM shifts to a horizontal arrangement with a Chip Last process. It first completes the redistribution layers before mounting the chips onto them.

  While InFO offers high integration, the surge in memory capacity demands driven by AI applications has led to taller memory module stacks, significantly increasing packaging thickness and manufacturing complexity. Meanwhile, higher SoC power consumption has also made heat dissipation more challenging. By placing storage and processors side by side, WMCM improves thermal management while maintaining high performance and providing greater flexibility in storage configurations.

  Guo Mingji, an analyst at Tianfeng International Securities, noted that Changxing Materials has been adopted by TSMC to supply liquid molding compound (LMC) and mold underfill (MUF) for Apple's 2026 iPhone and Mac chips. MUF technology integrates the underfill and molding processes into a single step, reducing material usage, shortening production time, and improving yield rates—directly supporting Apple's WMCM strategy.

  Industry insiders believe WMCM packaging will grant Apple greater product line flexibility: CPU, GPU, and neural network engines can be divided into independent modules for combination, making performance differentiation between the A20 and A20 Pro more distinct while accelerating the R&D and design cycles of different product lines.

  Additionally, Apple is exploring the SoIC (System on Integrated Chips) stacking solution, which directly stacks two advanced chips to form ultra-high-density interconnections, reducing latency and enhancing performance and energy efficiency. However, SoIC technology is expected to be applied only to the M5 series chips for MacBook Pro launching in 2026, not the iPhone 18 series—indicating   Apple will select the most suitable packaging 方案 based on the design requirements and cost structures of different products.